Tata Consultancy Services (TCS) has recently launched its innovative chiplet-based system engineering services, aiming to accelerate semiconductor design and boost technological advancements in India and globally. This new offering from TCS is positioned to help semiconductor companies develop faster, more powerful, and cost-efficient chips by leveraging chiplet technology, which is emerging as the next frontier in chip design amid the limits of traditional transistor shrinking.
Chiplets are smaller integrated circuits that can be combined or “mixed and matched” to form advanced multi-chip products with improved performance and scalability. Instead of relying solely on making bigger chips more densely packed with transistors—a practice that is becoming increasingly difficult and expensive—chiplet design allows semiconductor firms to flexibly integrate different chip components. This approach reduces costs, shortens development timelines, and supports next-generation applications such as artificial intelligence, cloud computing, electric vehicles, and connected devices.
TCS’s chiplet-based engineering services provide comprehensive solutions including chip design, verification against industry standards like Universal Chiplet Interconnect Express (UCIe) and High Bandwidth Memory (HBM), and advanced packaging technologies such as 2.5D and 3D interposers and multi-layer organic substrates. These advanced packaging technologies ensure superior signal integrity, lower latency, and compact form factors in multi-chip systems, which are critical for high-performance computing needs.
This launch aligns with India’s booming semiconductor market, which is expected to more than double from $45-50 billion in 2024-2025 to around $100-110 billion by 2030. This growth is powered by government initiatives such as the ₹76,000 crore India Semiconductor Mission, which is fostering domestic fabrication, design, and manufacturing capabilities to position India as a global semiconductor hub. India already hosts 20% of the world’s chip design engineers, and TCS’s new chiplet services are expected to further enhance the ecosystem by providing both Indian and international semiconductor companies access to world-class chip-to-system engineering expertise.
V Rajanna, President, Technology, Software and Services at TCS, emphasized the significance of the launch stating, “Semiconductors are the foundational technology driving digital innovation and powering differentiated experiences. TCS Chiplet-based System Engineering services will help semiconductor enterprises accelerate chiplet tapeout, driving flexibility, scalability, and faster time to market. Our extensive investments in next-gen technologies, contextual knowledge of the semiconductor industry, and strong track record in execution make us the preferred partner to drive innovation at scale.”
TCS has already demonstrated the value of its chiplet engineering approach through a recent collaboration with a leading North American semiconductor firm, simplifying heterogeneous chip integration and speeding up the launch of industry-leading AI processors. This real-world implementation showcases how the company’s expertise supports complex multi-chip designs that combine different chip types into efficient systems.
Through this move, TCS not only advances semiconductor innovation but also strongly supports India’s ambition of becoming a global leader in semiconductor design and manufacturing. The company’s broad portfolio of chip-to-system engineering services—now including chiplet-based system engineering—democratizes access to next-generation chip design methodologies, enabling a wider range of customers to develop cutting-edge chips with improved efficiency and performance.
By delivering faster turnaround times, scalable system designs, and cost-effective production, TCS’s chiplet-based services address major industry pain points related to traditional monolithic chip design. This innovation is timely, given the rapidly growing global semiconductor demand fueled by technologies such as AI, 5G, advanced automotive electronics, and IoT devices.
In conclusion, TCS’s chiplet-based system engineering services represent a significant step forward in semiconductor innovation, combining advanced technology, deep industry expertise, and alignment with national semiconductor goals. This initiative is poised to benefit semiconductor companies seeking to accelerate product development, reduce costs, and bring powerful new chips to market faster—in line with the escalating demands of today’s digital economy.
